Download Practical Guide to the Packaging of Electronics – Practical Guide to the Packaging of Electronics : As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance.
Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification.
Table of Contents
Practical Guide to the Packaging of Electronics
This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest.
Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities.
By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.
Practical Guide to the Packaging of Electronics – Contents
Introduction. Basic Heat Transfer. Conduction, Convection and Radiation. Conductive Cooling. Radiation Cooling. Fundamentals of Convection Cooling. Combined Modes as well as Transient Heat Transfer. Basics of Vibration and its Isolation. Basics of Shock Management. Induced Stresses. The Finite Element Methods. The Finite Element Analysis Procedure. Mechancial and Thermomechanical Concerns. Mechanical Reliability.
Electrical Reliability. Chemically Induced Reliability. Design Considerations in an Avionics Electronic Package. Appendices. References.
Practical Guide to the Packaging of Electronics – Preface
It has been six years since the first edition of this book was published. My goal has always been to write a book that would enable readers to pick up what they need to evaluate an electronics system, and have a set of tools for back-of-the-envelope calculations. Unfortunately, in my first attempt, I did not pay enough attention to details and assumed that the reader would make the leaps across developing formulas and derivations with me. I realized I was mistaken during a workshop when one of the participants brought this to my attention. I can only hope that I have been more successful this time. I am still trying to make a simple enough book that is not inundated with lots of equations and too many details. A few of my colleagues still believe that there should not be any equations at all, just design tips. Although this approach may work for some, particularly those who are concerned only with design, many of us need to make sure that our designs are functional, especially if we are working on a new product. This assurance comes only through calculations first and then testing. The arrangement of the chapters in this edition is somewhat different from the first. There are 15 chapters now as opposed to 11. Also, there are seven appendices. In addition, there is now a chapter on chemical attacks. Hopefully, the information flows more naturally in this configuration. Practical Guide to the Packaging of Electronics
Here, I have a chance to talk to you—the reader—face to face and give you a brief history of how this book came into existence. In 1993–1994, I developed an interest in the issues of electronics packaging. By 1995, I could easily simulate an electronics system using state-of-the-art computer programs and calculate its thermal and vibration characteristics. It became apparent to me, however, that without these sophisticated tools, I had no simple way for estimating the same characteristics and hence could not do back-of-the-envelope calculations. I noticed that there are plenty of good books and references on electronics packaging on the market, but the majority seem to make the assumption that the reader is already familiar with the basic approaches and how to make back-of-theenvelope calculations. Practical Guide to the Packaging of Electronics
Later on, I discovered—much to my surprise—that there are not many engineers who have this set of tools. It was at that time that I embarked on developing a basic understanding of the engineering involved in electronics packaging and eventually presenting them throughout this book. Herein, I have not set forth to bring together the latest and most accurate techniques or to cover all aspects of electronics packaging. My goal has been to develop a book that can be read (and comprehended) either in a week’s time or over a few weekends. And it provides the basics that an engineer—mechanical, biomedical, or electrical—needs to keep in mind when designing a new system or troubleshooting a current one. Furthermore, this book serves program and engineering managers, as well as quality assurance directors to refresh their basics every once in a while. I hope that this work is of service to them as well. This work is based on my seminar notes that the Society of Automotive Engineers has sponsored.
In my career as a research engineer (and now a senior design engineer), I have been blessed with meeting some very brilliant people who have left their imprint on me. Two persons have played key roles in that they have helped me make substantial changes in the direction that my career has taken. The first of these is Mr. Robert E. Walter, who helped me bridge the gap between the world of research and concepts and the world of “real” engineering and manufacturing. The second person who helped me make an even more important leap is Dr. Jack Chen, who at one time accepted the role of being my mentor. Practical Guide to the Packaging of Electronics
Through Dr. Chen’s guidance, I have brought the world of research and engineering together in order to develop an understanding of what it means to be an innovator. Although I have not worked with either of these two gentlemen for a long time now, I acknowledge their roles in my life and express my indebtedness to them. Writing this book (in both of its editions) has not been easy. The second edition took just about as much time as the first. It has meant time spent away from my daughter, Naseem, my son, Seena, and my wife, Mojdeh. They have been wonderful and supportive and this is the time for me to say thanks for your support.
This book is specifically for electronics enclosure analysis and design for the practical engineer, it’s not for a researcher. I’m currently doing thermal analysis of servers so this is a good semi starting point. The last time I delved deeply into heat transfer was in college and a bit at a previous company.
I find the text to be clear and precise, such as when sizing a fan he mentions that most fan catalogs list fans using volumetric flow rate(cfm), not mass flow rate, so he rearranges the formula accordingly. It covers the 3 modes of heat transfer, convection, conduction and radiation as well as vibration, shock and finite element procedures. It also includes mechanical and thermomechanical chapters so it’s not just thermal it is the whole packaging of electronics. I found the CAD/CAM/CFD discussion very practical to my situation as I’m currently trying to figure out which CFD program my company should buy.Practical Guide to the Packaging of Electronics
One thing I would have liked to have seen was the JEDEC compact thermal modeling explained and other typical industry standards. I think a chapter or two on typical test setups and procedures would have been good. Other than that I can’t think of any other problems. It should obviously be named “Practical Guide to Electronics Packaging” for better English.
In short don’t look for a lot of integrals or Navier-Stokes level math in here or cutting edge technology but if you work in a small/medium size company and need to understand well enough to do straight forward enclosure analysis that will get you by until you can afford the very expensive CFD sofware, this is great.
About the Author
Ali Jamnia enjoys teaching and mentoring junior engineers. His primary expertise lies in electromechanical systems design and development. In addition, he enjoys conducting analysis of various engineering problems using numerical approximations and computer simulations.Dr. Jamnia has focused on the issues of electronics packaging since the early 1990s, and since 1995, has been involved with the development of innovative electronics systems to aid individuals with either physical or cognitive disabilities. In fact, his prime achievement has been the development of a specialized computer system called the Learning StationTM – used as a teaching tool for individuals with cognitive disabilities.